| PART |
Description |
Maker |
| MM3Z10VS |
Planar Die Construction
|
TY Semiconductor Co., L...
|
| MMBZ5228B |
Planar Die Construction
|
TY Semiconductor Co., L...
|
| MMSTA13 |
Epitaxial Planar Die Construction
|
TY Semiconductor Co., Ltd
|
| UMB10MN |
Glass Passivated Die Construction
|
DIYI Electronic Technol...
|
| MBR850 |
Guard Ring Die Construction for Transient Protection
|
Kersemi Electronic Co., Ltd.
Kersemi Electronic Co., Ltd...
|
| 408-8737 |
The die assembly consists of an indenter die and nest die. Each die is held in the tool by a single screw
|
Tyco Electronics
|
| TLE5009A16 |
Available as single die and dual die with separate supplies for each die
|
Infineon Technologies A...
|
| ZBS |
Cemented Resistors with Corrugated Ribbon, All welded construction, Power rating up to 500 watt, Corrugated ribbon construction aids rapid cooling, Available in adjustable design
|
Vishay
|
| CPSL |
Low Value, Commercial Power, Four Lead, Fireproof Inorganic Construction, Current Sensing, High Power/Size Ratio, Complete Welded Construction, High Thermal Conductivity and Moisture Resistance for Aqueous Board Wash Systems
|
Vishay
|
| AM29BL802C_03 AM29BL802C AM29BL802CB80DGE1 AM29BL8 |
Am29BL802C (Known Good Die Supplement)
8 Megabit (512 K x 16-Bit) CMOS 3.0 Volt-only, Burst-mode, Boot Sector Flash Memory-Die Revision 1
|
Advanced Micro Devices
SPANSION[SPANSION]
|
| RD25050-W-AU RD25100-W-AU RD251000-W-AU RD25200-W- |
50 V, 25 A, rectifier automotive die
100 V, 25 A, rectifier automotive die
1000 V, 25 A, rectifier automotive die
200 V, 25 A, rectifier automotive die
|
TRANSYS Electronics Limited
|
